6052E低熱膨脹系數聚酰亞胺薄膜是由新型酐單體及新型胺單體的新配方制成的聚酰氨酸樹脂，經雙向拉伸工藝生產的新型亞胺薄膜，它不僅具有普通聚酰亞胺薄膜的所有優(yōu)異性能，且具有更高的尺寸穩(wěn)定性，高彈性模量及低熱膨脹系數。
6052E低熱膨脹系數聚酰亞胺薄膜 的詳細介紹
一、技術要求：
1、厚度與寬度
| 標稱厚度 | 12.5 | 25.0 |
| 允許偏差 | +1/-1 | +1/-2 |
| ≤520 | ≤520 | |
| 注：厚度也可根據用戶要求供應。 | ||
2、性能指標
序號 | 指標名稱 | 單位 | 指標值 | ||
12.5μm | 25.0μm | ||||
1 | 拉伸強度 | 縱向及橫向 | MPa | ≥200 | |
2 | 斷裂伸長度率 | 縱向及橫向 | % | ≥40 | |
| 3 | 拉伸模量 | 縱向及橫向 | GPa | ≥4.0 | |
4 | 熱收縮率 縱向及橫向 | % | ≤0.1 | ||
5 | 工頻電氣強度 | 平均值 | MV/m | ≥200 | |
6 | 熱膨脹系數 25-200℃ | ppm/℃ | 15-25 | ||
吸濕性 100%RH | % | ≤2.5 | |||
7 | 體積電阻率200℃ | Ω·M | ≥1.0X1012 | ||
8 | 相對介電常數48-62Hz | -- | 3.0-3.5 | ||
9 | 介質損耗因數48-62Hz | -- | ≤0.002 | ||
6052E低熱膨脹系數聚酰亞胺薄膜
二、應用領域
6025E低熱膨脹系數聚酰亞胺薄膜其尺寸穩(wěn)定性高，CTE與銅箔相近特別適用于FPC行業(yè)制作覆筒板需要。
6052E Low Expansion Coefficient Polyimide Film
With the application of Bi-axial stretching Technology, this brand polyimide film, the low thermal expansion coefficient polyimide film, is made from polyamic acid resins, which is obtained from a novel formula comprised of new anhydride monomers as well as a mine monomers. It not only processes good performance of ordinary polyimide film but also has better dimension stability, higher modulus of elasticity and lower heat expansion coefficient.
1. Technical Requirement
1.1 Thickness and Width
Thickness | 12.5 | 25.0 |
Tolerance | +1/-1 | +1/-2 |
| Width | ≤520 | ≤520 |
Notes: Thickness is supplied as the requests of customer | ||
1.2 Performace Index
No. | Index | Unit | Index Value | ||
12.5μm | 25.0μm | ||||
1 | Tensile | CD / MD | MPa | ≥200 | |
2 | Elongation | CD / MD | % | ≥40 | |
3 | Tensile modulus | CD / MD | GPa | ≥4.0 | |
| 4 | Heat expansion coefficient | % | ≤0.1 | ||
| 5 | Electrical operating frequency intensity | Average | MV/m | ≥200 | |
| 6 | Heat expansion coefficient 25-200℃ | ppm / ℃ | 15-25 | ||
5 | A wet sexual 100% RH | % | ≤2.5 | ||
6 | Volume resistivity 200℃ | Ω ·cm | ≥1.0X1012 | ||
7 | Relative dielectric constant 48-62Hz | -- | 3.0-3.5 | ||
8 | Dielectric loss factor 48-62Hz | -- | ≤0.002 | ||
2. Application
6052E low expansion coefficient polyimide film processes higher dimension stability. Its CTE is very near copper foil which is ideal material for FPC as copper board cover.
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